Parallel glide: flow of dislocations with internal stress source/sink distribution

Parallel glide: flow of dislocations with internal stress source/sink distribution

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The unexpected glide of Fixed Blade Tactical dislocations on a plane parallel to the film/substrate interface in ultrathin copper films, which has been called parallel glide (Balk et al 2003 Acta Metall.51 447), is described using an analytical model.The phenomenon is observed as a problem involving inlet/outlet flow from different positions of a grain boundary into the grain channel.In this sense, parallel glide is presented as Mountaineering - Femme - Vetements - Manteau the flow of dislocations with an internal stress source/sink distribution.